BSFxxxxMCPGM SERIES


    Attachment

    Series Specification

    SPECIFICATION OF BSFxxxxMCPGM SERIES

    FEATURE

    1.Metal material for large current and low loss.
    2.High performance (Isat) realized by metal dust core.
    3.Low loss realized with low Rdc.
    4.Closed magnetic circuit design reduces leakage flux.
    5.Vinyl thermal spray, better surface compactness.
    6. RoHS compliant.
     
    APPLICATIONS

    DC/DC Converters.
    Pad,Smartphone.
    Portable gaming devices, Smart wear, Wi-Fi module.
    Notebooks, VR, AR.
    LCD displays, HDDs, DVCs, DSCs, etc.

    ORDERING CODE.
    BSFxxxxMCPGM SERIES
    1. PRODUCT TYPE CODE AND SIZE CODE
    2. INDUCTANCE
    3. INDUCTANCE TOLERANCE(M: ±20%,N: ±30%)
    4. REEL TAPING
    SHAPE & DIMENSIONS Unit:(mm)
    BSFxxxxMCPGM SERIESBSFxxxxMCPGM SERIES

    UNIT : mm (inch)

    SIZE CODEA
    mm    		B
    mm    		C
    mm    		D
    mm    		E
    mm    		F
    mm    		G
    mm    		H
    mm    		 
    BSF2510MCPGM2.5±0.22.0±0.21.0max0.85±0.200.8±0.22.60.72.1 
    BSF2512MCPGM2.5±0.22.0±0.21.2max0.85±0.200.8±0.22.60.72.1 
    BSF3212MCPGM3.2±0.22.5±0.21.2max1.05±0.201.0±0.23.20.92.5 
    BSF4012MCPGM4.1±0.24.1±0.21.2max1.4±0.21.3±0.24.11.14.1 
    1. Other sizes are available upon request.
    2. All the data listed in this catalogue are for reference only; King Core reserves
      the right to alter or revise the specifications without prior notification.
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