SPECIFICATION OF WCM SERIES
FEATURE
Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805
and 1812 size; with best EMI suppression effect but least impact to data signal wave form.
APPLICATIONS
Preventive measure against high speed signal radiation emissions such as USB 2.0; IEEE1394 or LAN interface. Best for NB; DSC; mobile device design.